Fluid monitoring system and method for semiconductor fabrication tools

ABSTRACT

A system and method provide for monitoring and controlling fluid flow in semiconductor manufacturing apparatuses. The method and system include a vortex flow meter coupled to a digital readout that displays the measured flow rate and trip point. The flow meter display includes input devices used to adjust the trip point. The system and method provide for sending signals via a custom relay to the semiconductor manufacturing apparatus which is adapted to terminate a processing operation or change the fluid flow if the trip point is tripped. The system and method also provide for sending an electrical signal to a computer by way of a data acquisition unit and a converter. The converter converts the signal to a communication protocol consistent with the computer network and provides fluid flow information and trip point data as a function of time to the computer which then displays such data graphically.

RELATED APPLICATIONS

This application is a regular application based on and claiming priorityof U.S. provisional application Ser. No. 62/095,615, entitled “FluidMonitoring System and Method for Semiconductor Fabrication Tools,” filedDec. 22, 2014, the contents of which are hereby incorporated byreference as if set forth in their entirety.

BACKGROUND

Various types of semiconductor fabrication processing apparatuses, i.e.tools, are used to perform various processing operations uponsemiconductor substrates in the manufacture/fabrication of semiconductordevices. Regardless of the processing operation carried out in thesemiconductor manufacturing tool, the processing chambers within whichthe processing operations take place, are maintained at a desiredtemperature in order to efficiently carry out the processing upon thesubstrates and also to avoid equipment problems associated with thesystem becoming too hot or cold.

In order to maintain the manufacturing tool at a desired temperaturelevel, fluids such as water, various other coolants, and various otherfluids with high thermal conductivities, are used to flow throughout themanufacturing tools in fluid circulation systems to maintain theprocessing chambers at desired temperatures. If the flow levels withinthe heating or cooling loops are too high or too low, the temperature ofthe processing chamber may become too hot or too cold. This results inmisprocessing of the substrates. This also results in various mechanicalfailures such as the melting of components of a fabrication tool, when aflow rate of cooling fluid, for example, is too low. Flow monitoringsystems are used in conjunction with such heating and cooling fluidcirculation systems.

BRIEF DESCRIPTION OF THE DRAWING

The present disclosure is best understood from the following detaileddescription when read in conjunction with the accompanying drawing. Itis emphasized that, according to common practice, the various featuresof the drawing are not necessarily to scale. On the contrary, thedimensions of the various features are arbitrarily expanded or reducedfor clarity. Like numerals denote like features throughout thespecification and drawing.

FIG. 1 is a schematic showing components of the fluid monitoring systemaccording to various embodiments of the disclosure;

FIG. 2 shows a vortex flow meter and a fluid delivery system thatdelivers fluid to the processing chamber body according to variousembodiments of the disclosure; and

FIG. 3 shows a vortex flow meter and a fluid delivery system thatdelivers fluid to an internal component of a processing chamberaccording to various embodiments of the disclosure.

DETAILED DESCRIPTION

The present disclosure, in various embodiments, provides a system andmethod for monitoring fluid flow in a semiconductor manufacturingapparatus. In some embodiments, the fluid flow is a cooling or heatingfluid directed to a chamber or to multiple chambers in a multiplechamber semiconductor manufacturing apparatus. The fluid is a liquid insome embodiments and is a gas in other embodiments. The fluid is used,in some embodiments, to maintain the chamber body at a desiredtemperature level and according to such embodiments, the fluid maycirculate through pipes, tubes or other conduits that are conterminouswith the surface of the chamber or chambers, or within the walls of thechamber or chambers themselves. In other embodiments, the fluid flow isin various pipes, tubes or other conduits and is directed to one or moreinternal components of a chamber such as an anode or a cathode orvarious other components that are desirably maintained within aparticular temperature range. The disclosure relates to various types ofsemiconductor manufacturing apparatuses such as but not limited tochemical vapor deposition, CVD, manufacturing apparatuses, metalevaporation tools, sputtering apparatuses, other physical vapordeposition, PVD, tools, various etching apparatuses including reactiveion etching and ion milling apparatuses, photolithography tools, thermalprocessing apparatuses, atomic layer deposition, ALD, apparatuses, highdensity plasma, HDP, deposition tools, other deposition apparatuses, andvarious other semiconductor manufacturing tools

The present disclosure, in various embodiments provides low flowresistance vortex style flow meters and a digital readout of themeasured flow. Vortex flow meters include no moving parts and thereforedo not trap air or use magnetic sensors that can improperly influencethe flow reading.

A vortex flow meter provides a method of flow measurement that involvesa bluff body (called a shredder bar) placed in the path of the flowingfluid in some embodiments. The bluff body placed in the path of theflowing fluid creates a low pressure zone behind the bluff body in someembodiments. As the fluid passes this body, disturbances in the flowcalled vortices are created. The vortices trail behind the bluff bodycylinder, alternatively from each side of the bluff body. This vortextrail is sometimes called the Von Kármán vortex street, after VonKármán's 1912 mathematical description of the phenomenon. The frequencyat which these vortices alternate size is essentially proportional tothe flow rate of the fluid. Inside, atop, or downstream of the shredderbar is a sensor for measuring the frequency of the vortex shedding. Insome embodiments, the sensor is a piezoelectric crystal, which producesa voltage pulse every time a vortex is created. Various other suitablesensors are used in other embodiments. The frequency of such a voltagepulse is proportional to the fluid velocity and a volumetric flow rateis calculated using the cross-sectional area of the flow meter. In someembodiments, the frequency is measured and the flow rate is calculatedby the flow meter electronics using the equation f=SV/L, where f is thefrequency of the vortices, L is the characteristic length of the bluffbody, V is the velocity of the flow over the bluff body and S is theStrouhal number, which is essentially a constant for a given body shapewithin its operating limits. The aforementioned description describessome vortex flow meter embodiments, but other types of vortex flowmeters with other sensors are used in other embodiments.

The vortex flow meter is coupled to an electronic flow rate display. Theflow rate display provides a digital readout of the measured fluid flowand also a digital readout of the trip point for the flow meter. Thevortex flow meter or the flow meter display includes an input membersuch as but not limited to a button, dial, thumbwheel, or other inputdevice for changing the trip point setting. The adjusted trip point isthen displayed digitally on the flow meter display.

The trip point is a set point that is “tripped” when the measured flowrate exceeds or falls below the trip point, depending on the embodiment.In some embodiments, the trip point represents a set value below whichfluid flow is desired to be maintained. According to this embodiment,when the fluid flow exceeds the trip point, it trips the trip point.According to other embodiments, the trip point is a set point indicatinga flow value above which the fluid flow is desired to be maintained.According to this embodiment, when the fluid flow falls below the trippoint, the trip point is tripped.

The present disclosure, in various embodiments also provides for theflow meter and/or the flow meter display providing an electrical signalto the semiconductor manufacturing apparatus when the trip point istripped. In some embodiments, the semiconductor manufacturing apparatusautomatically turns off the processing chamber associated with thetripped trip point, when the trip point is “tripped.”

The present disclosure, in various embodiments also provides for theflow meter and/or the flow meter display directing an electrical signalto a computer or other processor. The signal sent to the computer orother processor indicates the measured flow rate, the trip point valueand whether or not the trip point value has been tripped. The computeror other processor provides for remote control of the flow meter.According to some embodiments, the computer or other processor can beused to change the trip point. The computer or other processor alsodisplays the measured flow values and trip point as a function of timeand may be positioned at a remote location. The computer or otherprocessor also displays the measured flow values and trip points formultiple chambers of a semiconductor manufacturing apparatus. Trendsover time for the various flow rates are thus provided. In someembodiments, the computer or other processor is also coupled to thesemiconductor manufacturing apparatus itself and if a user notices thata trip point has been tripped, the user can utilize the computer orother processor to communicate directly with the semiconductormanufacturing apparatus and terminate the processing operation orotherwise adjust the semiconductor manufacturing apparatus.

FIG. 1 is a schematic showing aspects of the method and system of thedisclosure. Fab tool 2 is a semiconductor manufacturing apparatus withina semiconductor manufacturing facility. In some embodiments, fab tool 2is a chemical vapor deposition, CVD, manufacturing apparatus. In otherembodiments, fab tool 2 is a metal evaporation tool, sputteringapparatus, another physical vapor deposition, PVD, tool, various etchingapparatuses including reactive ion etching and ion milling,photolithography tools, thermal processing apparatuses, atomic layerdeposition, ALD, apparatuses, high density plasma, HDP, deposition toolsother deposition apparatuses, and various other semiconductormanufacturing tools. In the illustrated embodiment, fab tool 2 includesfour processing chambers 6 and also a transfer station 10. In otherembodiments, other numbers of processing chambers are present. Coupledto one or all of processing chambers 6 is a fluid circulation system(such as shown in FIGS. 2 and 3) with at least one vortex flow meter 4.In some embodiments, a fluid circulation loop with at least one vortexflow meter is also coupled to transfer station 10.

Vortex flow meter 4 is as described above and is alternatively describedas a low-resistance flow meter. Vortex flow meters manufactured byvarious companies, can be used. In one embodiment, the vortex flow meteris a model PF2W520T-NO3-1 device manufactured by SMC Corporation ofJapan, manufacturer of various pneumatic devices, but other vortex flowmeters are used in other embodiments. Vortex flow meters 4 include nomoving parts as described above. In some embodiments, vortex flow meter4 also functions as a flow controller that controls the flow of coolingor other fluids delivered from the fluid source to processing chambers6.

In some embodiments, each of processing chambers 6 includes at least onefluid flow circulation system in which fluid is delivered to the chamberand the fluid flow in the fluid circulation system is measured by anassociated vortex flow meter 4. In some embodiments, processing chamber6 includes a fluid flow circulation system with a heating or coolingfluid directed to the chamber body for maintaining a temperature of thechamber and also a fluid flow directed to one or more internalcomponents of the processing chamber 6. In some embodiments, processingchamber 6 includes a fluid flow circulation system with a heating orcooling fluid directed to the chamber body for maintaining a temperatureof the chamber and also to one or more internal components of theprocessing chamber 6.

Now referring to FIG. 2, according to one embodiment, processing chamber6 has a chamber wall that includes outer surface 52. Processing chamber6 may be a processing chamber for carrying out various semiconductormanufacturing operations in various semiconductor manufacturingapparatuses (fab tool 2 of FIG. 1) that contain one or multipleprocessing chambers 6. Fluid input line 50 is part of fluid circulationsystem 48 that delivers fluid to conduits 54, which contact outersurface 52 of processing chamber 6 or form part of the chamber wall thatincludes outer surface 52. Conduits 54 may be pipes, tubes or otherconduits made of various suitable materials such as metal or othersuitable materials, and in some embodiments, conduits 54 represent agroove or other passageway formed within the chamber walls of processingchamber 6, i.e. within outer surface 52, as indicated by the dashed lineportions of conduit 54. In some embodiments, conduits 54 are ridges thatextend along outer surface 52 but form a unitary piece with processingchamber 6 or with the outer chamber wall of processing chamber 6. Fluidoutput line 56 of fluid circulation system 48 contains the thermalcontrol fluid, i.e., heating or cooling fluid after it has been used toheat or cool processing chamber 6. In various embodiments, the fluiddelivered through fluid input line 50 is water or deionized water mixedwith ethylene glycol, but other suitable heating or cooling fluids suchas propylene glycol and any number of heat transfer fluid blends, may beused in other embodiments. Vortex flow meter 4 is coupled to andmeasures fluid flow in a fluid input line 50 in the illustratedembodiment.

In other embodiments, vortex flow meter 4 is coupled to fluid outputline 56. Vortex flow meter 4 delivers signal 12, which will be describedin conjunction with FIG. 1.

FIG. 3 illustrates another embodiment in which cooling or heating fluidis delivered via fluid circulation system 70, to a component internal toprocessing chamber 6. In FIG. 3, processing chamber 6 includes internalcomponent 64. In some embodiments, a processing chamber 6 includesheating or cooling fluid delivered both to the chamber body, such asshown in FIG. 2, and also to an internal component, such as internalcomponent 64 of FIG. 3. Fluid circulation system 70 of FIG. 3 includesfluid input line 66 and fluid output line 68. In various embodiments,there may be one or two fluid circulation systems. In some embodiments,one fluid delivery line provides fluid both to the chamber body such asshown in FIG. 2, and also to an internal component such as internalcomponent 64 shown in FIG. 3. In some embodiments, one fluid circulationsystem delivers fluid to the chamber body such as shown in FIG. 2, andanother fluid circulation system delivers fluid to the internalcomponent such as internal component 64 as shown in FIG. 3.

In some embodiments, internal component 64 is an anode, a cathode, asputtering target chuck, or various other components such as a heater orsusceptor, for which it is desired to maintain the component within aparticular temperature range. Fluid input line 66 of fluid circulationsystem 70 delivers the cooling or heating fluid to internal component 64and fluid output line 68 of fluid circulation system 70 delivers theoutput fluid. Vortex flow meter 4 is coupled to fluid input line 66 andis capable of measuring flow within fluid input line 66 in theembodiment illustrated in FIG. 3. In other embodiments, vortex flowmeter 4 is coupled to fluid output line 68. Referring to FIGS. 2 and 3,vortex flow meter 4 may be disposed at any location along fluid inputline 66 at which vortex flow meter 4 can measure the fluid flow rate ofthe cooling or heating fluid delivered to the processing chamber. Insome embodiments, vortex flow meter is disposed to measure the fluidflow rate of the cooling or heating fluid at a location immediatelybefore the cooling or heating fluid reaches the processing chamber 6. Inother embodiments, vortex flow meter 4 may be disposed at any of variouslocations along fluid output line 68. Vortex flow meter 4 sends anelectrical signal 12, as will be discussed in conjunction with FIG. 1.

Again referring to FIG. 1, vortex flow meter 4 provides electricalsignal 12 to flow meter display 8. In some embodiments, flow meterdisplay 8 is a unit manufactured by SMC Corp. of Japan and is a remotedisplay. Flow meter display 8 digitally displays both the measured flowand trip point values in some embodiments. Flow meter display 8 providesclear digital readouts and, together with vortex flow meter 4, thereadouts have a resolution accuracy of up to 0.05 gallons per minute.The trip point can be set to various accuracies including an accuracy of0.05 gallons per minute. Input members 22 can be used to adjust the trippoint values on the flow meter display 8. Input members 22 are buttons,knobs, dials, thumbwheels, or other input devices that can be used toadjust the trip point in various embodiments. Input members 22 aredisposed on or coupled to flow meter display 8. In some embodiments suchas shown in FIG. 1, flow meter display 8 displays a single value at anygiven time, i.e. the measured flow rate or the trip point. In otherembodiments, flow meter display 8 displays both values simultaneously,i.e. flow meter display 8 includes two digital readouts. In someexemplary embodiments, flow meter display 8 displays a single value atany given time, but input members 22 can be used to toggle between themeasured flow display and the trip point display.

Flow meter display 8 is directly coupled to vortex flow meter 4 and invarious embodiments in which multiple vortex flow meters 4 are used inconjunction with multiple processing chambers 6, there are multiple flowmeter displays 8, each associated with a vortex flow meter 4. In someembodiments, fab tool 2 includes multiple processing chambers 6 and eachprocessing chamber 6 includes an associated vortex flow meter 4 and flowmeter display 8. In some embodiments, the disclosure provides anenclosure custom fitted to the particular semiconductor manufacturingapparatus, the custom fitting including each of the flow meter displays8 such that each of the flow meter displays is simultaneously viewableby an observer.

Flow meter display 8 sends electrical signal 14 to fab tool 2 andelectrical signal 24 to computer 44 in the embodiment of FIG. 1. In someembodiments, the vortex flow meter 4 sends electrical signal 14 to fabtool 2 and electrical signal 24 to computer 44. In various embodiments,at least one of vortex flow meter 4 and flow meter display 8 deliverselectrical signal 24 to computer 44 or another processor, and electricalsignal 14 to fab tool 2. Electrical signal 24 includes informationindicating if the measured fluid flow rate has tripped the trip point.In various embodiments, signal 24 further contains and deliversinformation regarding the measured fluid flow rate and the trip point tocomputer 44 or another processor. Computer 44 or another processor isconfigured to display the flow and the fluid flow trip point setting ata remote location.

Electrical signal 14 is delivered to fab tool 2 through processing board16. Processing board 16 receives electrical signal 14 as an input signalfrom flow meter display 8 and in various embodiments, processing board16 includes multiple relays and other electrical components that producea different type of electrical signal from the input electrical signal14. Flow meter display 8 delivers electrical signal 14 which may be inthe form of an NPN signal, i.e. a signal through an NPN transistor, or aPNP signal, i.e. a signal through a PNP transistor, in variousembodiments, but other types of signals are used in other embodiments.NPN and PNP bipolar transistors each advantageously produce appreciablecurrent and are generated from a small semiconductor device. Accordingto the embodiment in which electrical signal 14 is an NPN signal, asmall current entering the base of an NPN transistor disposed withinflow meter display 8 is amplified to produce a large emitter currentdelivered by flow meter display 8 as electrical signal 14. According tothe embodiment in which electrical signal 14 is a PNP signal, a smallcurrent leaving the base of a PNP transistor disposed within flow meterdisplay 8, is amplified in the collector output and delivered aselectrical signal 14 by flow meter display 8. In some embodiments of thedisclosure, the incoming signal that is amplified by the NPN or PNPtransistor may be electrical signal 12 from vortex flow meter 4. NPN andPNP signals are advantageously used in some embodiments because they aresolid state signals through an associated bipolar transistor which aresmall semiconductor devices, and enable a space savings with respect toa signal that passes through a relay and therefore requires additionalspace.

Processing board 16 provides a DC signal delivered along signal path 20,to fab tool 2 in various embodiments. Processing board 16 also receivesinput signal 18 which may be in the form of a DC signal, from fab tool2. In some embodiments, the DC signals (input signal 18 and the DCsignal along signal path 20) are 24VDC signals but in other embodiments,other DC signals are used.

In some embodiments, processing board 16 receives an NPN signal fromflow meter display 8 and converts it to a 24 VDC signal capable ofinterlocking fab tool 2. The electrical signal 14 output of flow meterdisplay 8 is an NPN transistor output in some embodiments, where thesignal is either an open signal or a ground (0V) signal, or a PNP outputin other embodiments where the signal may be an open signal or a +VDCsignal which may be up to +24V. Processing board 16 converts thesesignals to a DC signal delivered along signal path 20 to communicatewith fab tool 2 in some embodiments. The VDC signal delivered alongsignal path 20 is a 24 VDC signal in some embodiments and in someembodiments, additional information is sent along signal path 20 thatconveys information including the measured flow rate, the trip point andwhether the flow rate has tripped the trip point. In some embodiments,there are multiple flow meter displays 8, each associated with a chamber6 and therefore multiple input signals such as electrical signal 14, aredelivered to processing board 16. According to this embodiment, multipleVDC signals are delivered along signal path 20 to each of the multipleprocessing chambers 6.

If the trip point is tripped, fab tool 2 can automatically terminate theoperation in the affected chamber. In some embodiments, in which VDCsignal sent along signal path 20, is a 24 VDC signal, a 24 VDC hardwareinterlock is included at fab tool 2, enabling fab tool 2 to terminate aprocessing operation if a signal with a voltage other than 24 volts, isreceived. Fab tool 2 is responsive to the conditions of processing board16. Signal 18 indicates that the interlock signal for fab tool 2 goesfrom fab tool 2 through processing board 16 then back to fab tool 2 viaa signal sent along signal path 20. If the trip point is tripped, therelay of processing board 16 will open, such that the 24VDC signal fabtool 2 is lost, causing an interlocked condition. Fab tool 2 ispre-programmed by OEM (the Original Equipment Manufacturer) or otheruser to respond to this interlock condition and may terminate waferprocessing or prevent further processing. In some embodiments, if thetrip point is tripped, fab tool 2 can automatically adjust the flow ratein a fluid circulation line (such as fluid input line 50, conduits 54,fluid output line 56, fluid input line 66, fluid output line 68, shownin FIGS. 2 and 3) that it is in compliance with specification, i.e. suchthat it does not trip the trip point. In some embodiments, fab tool 2sends a signal to a flow controller coupled to a fluid circulation lineand in some embodiments in which vortex flow meter 4 is also a flowcontroller, fab tool 2 sends a signal to the flow controller of vortexflow meter 4 on fluid circulation line.

Flow meter display 8 also sends electrical signal 24 that eventuallyreaches computer 44 as shown in FIG. 1. In some embodiments, vortex flowmeter 4 sends electrical signal 24 that eventually reaches computer 44via data acquisition unit 26 and converter 28. Electrical signal 24 fromvortex flow meter 4 or from flow meter display 8 is an analog signal. Insome embodiments, data acquisition unit 26 produces signal 30 fromanalog electrical signal 24 using RS-485 communication protocol. Invarious embodiments, such as in FIG. 1, converter 28 converts the RS-485signal 30 to RS-232 signal 34 which is delivered to computer 44. TheRS-485 and RS-232 communication protocol is compatible with serialinputs for various computer networks, but other communication protocolsare used in other embodiments. Data acquisition unit 26 and converter 28enable multiple flow meter displays 8 to be daisy chained, i.e.connected in series to one another, and delivered to computer 44. Insome embodiments, each of data acquisition unit 26 and converter 28 areADAM (Advantech Corp.) brand devices. In some embodiments, dataacquisition member 26 is an ADAM brand data acquisition unit, andconverter 28 is an ADAM brand RS-232 to RS-485 converter and may beADAM-4017 and ADAM-4520 models, respectively, in some embodiments. Otherdevices are used in other embodiments. Together, these units receive ananalog voltage signal from flow meter display 8 and then communicatewith computer 44 by sending RS-232 signal 34.

The preceding components of processing board 16, flow meter display 8,data acquisition unit 26 and converter 28, form a “master system”associated with the illustrated fab tool 2 and vortex flow meter 4. Inthe illustrated master system, converter 28 combines with dataacquisition unit 26 to serve as a “master unit” which communicates witha network via computer 44.

Computer 44 represents various types of computers and other processorsin various embodiments and may include or access various networks invarious embodiments. Computer 44 receives RS-232 signal 34 for eachvortex flow meter 4 and displays the measured flow rate and trip pointand the comparison thereof over time. Long term flow rate trends aredisplayed graphically or in tabular or other formats in someembodiments. In some embodiments, computer 44 also communicates directlywith fab tool 2 via signal 46. In some embodiments, a user can usecomputer 44 to terminate a processing operation or send otherinstructions to fab tool 2 using signal 46. In some embodiments, a usercan use computer 44 to override an automatic response by fab tool 2, toterminate or continue a processing operation.

In addition to the master system described above, FIG. 1 alsoillustrates multiple slave units 40 such as may be present in variousembodiments. Slave units 40 are slaves to the master system becauseslave units 40 do not include an associated converter 28. Each slaveunit 40 is associated with another fab tool and another vortex flowmeter 4, i.e. a fab tool and vortex flow meter other than the fab tool 2and vortex flow meter 4 shown in FIG. 1. Each slave unit 40 represents aprocessing board, flow meter display and data acquisition unitassociated with another fab tool, but the slave units 40 do not includea converter 28. The processing board, flow meter display and dataacquisition unit associated with the slave units 40 may be the same asillustrated processing board 16, flow meter display 8 and dataacquisition unit 26 in various embodiments.

Each slave unit 40 is dedicated to an associated fab tool that may bedifferent than, or the same type of fab tool, as fab tool 2 of FIG. 1.Each slave unit 40 provides a signal which is delivered as signal 38 toconverter 28 of the master system. Because each slave unit 40 isassociated with the arrangement of components including data acquisitionunit 26 as indicated above, each slave unit 40 delivers signals 38 whichare similar to signals 30, each having been delivered from an associateddata acquisition unit 26.

Illustrated converter 28 thus receives signal 30 and signals 38. Signal30 is associated with fab tool 2 of the master system and signals 38 areassociated with the other fab tools associated with slave units 40.Converter 28 then converts signal 30 and signals 38 to signals 34, asdescribed above. Signals 34 are delivered to computer 44.

In various embodiments, all slave units 40 are connected to each otherand the master system shown in FIG. 1 using RS485 communication protocolin a parallel network such as shown in the embodiment illustrated inFIG. 1. The master system is coupled to multiple slave units 40, asillustrated, such that computer 44 provides fluid loop monitoring andcontrol to multiple fab tools.

In other embodiments with multiple fab tools, slave units 40 are notused and each fab tool 2 includes a master unit, i.e. includes both dataacquisition unit 26 and converter 28.

In still other embodiments, there are no additional fab tools and noslave units 40.

According to some aspects, provided is a fluid loop monitoring andcontrol system for a semiconductor manufacturing apparatus. The systemcomprises: a vortex flow meter coupled to a fluid circulation line thatdelivers a fluid to a chamber of the semiconductor manufacturingapparatus, the vortex flow meter configured to measure a fluid flow ratein the fluid circulation line; a flow meter display coupled to thevortex flow meter and including a digital readout of the measured fluidflow rate and a digital readout of a fluid flow trip point associatedwith the vortex flow meter; an input member disposed on or coupled tothe flow meter display and configured to adjust the trip point, and atleast one of the vortex flow meter and the flow meter display configuredto deliver an electrical signal to a computer or other processorindicating if the measured fluid flow rate has tripped the trip point.

According to some aspects, provided is a fluid loop monitoring andcontrol system for a semiconductor manufacturing apparatus. The systemcomprises a vortex flow meter coupled to a fluid circulation line thatdelivers a fluid to a processing chamber of the semiconductormanufacturing apparatus, the vortex flow meter configured to measure afluid flow rate in the fluid circulation line. The system also includesa flow meter display coupled to the vortex flow meter and including adigital readout of the measured fluid flow rate and a digital readout ofa fluid flow trip point associated with the vortex flow meter; an inputmember disposed on or coupled to the flow meter display and configuredto adjust the fluid flow trip point, and at least one of the vortex flowmeter and the flow meter display configured to deliver an electricalsignal to a computer or other processor indicating if the measured fluidflow rate has tripped the trip point. At least one of the vortex flowmeter and the flow meter display is configured to deliver a furtherelectrical signal with the measured fluid flow rate and the trip point,to the computer or other processor, the computer or other processorconfigured to display the flow and the fluid flow trip point setting ata remote location. The fluid circulation line delivers fluid to a bodyof the chamber and also to internal components of the chamber.

According to another aspect, a method for monitoring and controlling afluid flow in a semiconductor manufacturing apparatus, is provided. Themethod comprises: delivering a thermal control fluid via a fluidcirculation system to a chamber of a semiconductor manufacturingapparatus; measuring fluid flow rate in the fluid circulation systemusing a vortex flow meter; displaying an indication of the measuredfluid flow rate on a flow meter display, in digital format; displaying aflow trip point on the flow meter display in digital format; and sendingan electrical signal to the semiconductor manufacturing apparatusindicating if the trip point is tripped. At least one of the vortex flowmeter and the flow meter display delivers a further electrical signal toa computer or other processor, the further electrical signal includingthe measured fluid flow rate and the trip point; and the method. Themethod also provides for adjusting the fluid flow trip point using aninput device associated with the flow meter display or the flow meter.

The preceding merely illustrates the principles of the disclosure. Itwill thus be appreciated that those skilled in the art will be able todevise various arrangements which, although not explicitly described orshown herein, embody the principles of the disclosure and are includedwithin its spirit and scope. Furthermore, all examples and conditionallanguage recited herein are principally intended expressly to be onlyfor pedagogical purposes and to aid the reader in understanding theprinciples of the disclosure and the concepts contributed by theinventors to furthering the art, and are to be construed as beingwithout limitation to such specifically recited examples and conditions.Moreover, all statements herein reciting principles, aspects, andembodiments of the disclosure, as well as specific examples thereof, areintended to encompass both structural and functional equivalentsthereof. Additionally, it is intended that such equivalents include bothcurrently known equivalents and equivalents developed in the future,i.e., any elements developed that perform the same function, regardlessof structure.

This description of the exemplary embodiments is intended to be read inconnection with the figures of the accompanying drawing, which are to beconsidered part of the entire written description. In the description,relative terms such as “lower,” “upper,” “horizontal,” “vertical,”“above,” “below,” “up,” “down,” “top” and “bottom” as well asderivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,”etc.) should be construed to refer to the orientation as then describedor as shown in the drawing under discussion. These relative terms arefor convenience of description and do not require that the apparatus beconstructed or operated in a particular orientation. Terms concerningattachments, coupling and the like, such as “connected” and“interconnected,” refer to a relationship wherein structures are securedor attached to one another either directly or indirectly throughintervening structures, as well as both movable or rigid attachments orrelationships, unless expressly described otherwise.

Although the disclosure has been described in terms of exemplaryembodiments, it is not limited thereto. Rather, the appended claimsshould be construed broadly, to include other variants and embodimentsof the disclosure, which may be made by those skilled in the art withoutdeparting from the scope and range of equivalents of the disclosure.

1. A fluid loop monitoring and control system for a semiconductormanufacturing apparatus, said system comprising: a vortex flow metercoupled to a fluid circulation line that is configured to deliver afluid to a chamber of said semiconductor manufacturing apparatus, saidvortex flow meter configured to measure a fluid flow rate in said fluidcirculation line; a flow meter display coupled to said vortex flow meterand including a readout of said measured fluid flow rate and a readoutof a fluid flow trip point associated with said vortex flow meter; aninput member disposed on or coupled to said flow meter display andconfigured to adjust said trip point, and at least one of said vortexflow meter and said flow meter display configured to deliver anelectrical signal to a processor indicating if said measured fluid flowrate has tripped said trip point.
 2. The fluid loop monitoring andcontrol system as in claim 1, wherein said readout of said measuredfluid flow rate and said readout of said fluid flow trip point are eachdigital readouts, said at least one of said vortex flow meter and saidflow meter display is further configured to deliver a further electricalsignal with said measured fluid flow rate and said trip point, to saidprocessor, and said processor is configured to display said measuredfluid flow rate and said trip point setting at a remote location.
 3. Thefluid loop monitoring and control system as in claim 2, wherein saidsemiconductor manufacturing apparatus includes a plurality of saidchambers and corresponding ones of said vortex flow meters, flow meterdisplays, fluid circulation lines, and input members, and wherein saidprocessor is a computer configured to display corresponding ones of saidmeasured fluid flow rates and said trip point settings associated witheach of said plurality of said chambers, over time.
 4. The fluid loopmonitoring and control system as in claim 1, wherein said readout ofsaid measured fluid flow rate and said readout of said fluid flow trippoint are each digital readouts, said at least one of said vortex flowmeter and said flow meter display is configured to further deliver afurther electrical signal to said semiconductor manufacturing apparatusif said measured fluid flow trips said trip point, said furtherelectrical signal being a signal from an NPN or a PNP transistor.
 5. Thefluid loop monitoring and control system as in claim 4, wherein saidflow meter display is configured to deliver said further electricalsignal to said semiconductor manufacturing apparatus and furthercomprising a relay member configured to have said further electricalsignal pass therethrough, said relay member further configured toconvert said further electrical signal from said flow meter display, toa +24VDC signal.
 6. The fluid monitoring and control system as in claim4, wherein said semiconductor manufacturing apparatus is configured toautomatically terminate a processing operation or adjust said fluid flowrate if said measured fluid flow rate trips said trip point.
 7. Thefluid loop monitoring and control system as in claim 1, furthercomprising at least one data acquisition unit and a converter andwherein said at least one data acquisition unit is configured to convertan analog electrical signal from said flow meter display to an RS-485signal and wherein said converter is configured to convert said RS-485signal to a RS-232 signal.
 8. The fluid loop monitoring and controlsystem as in claim 1, wherein said fluid circulation line is disposed onsurfaces of components of said chamber and wherein said chamber is aprocessing chamber in which semiconductor device manufacturingoperations are carried out.
 9. The fluid loop monitoring and controlsystem as in claim 1, wherein said fluid circulation line is configuredto deliver said fluid to internal components of said chamber and whereinsaid chamber is a processing chamber in which semiconductor devicemanufacturing operations are carried out.
 10. The fluid loop monitoringand control system as in claim 1, wherein said fluid circulation line isdisposed in or on walls of said chamber and is also coupled to andconfigured to deliver said fluid, to internal components of saidchamber.
 11. The fluid loop monitoring and control system as in claim 1,wherein said semiconductor manufacturing apparatus includes a pluralityof said chambers and corresponding ones of said vortex flow meters, flowmeter displays and fluid circulation lines, said flow meter displaysarranged in a single unit mounted on said tool such that said flow meterdisplays are simultaneously viewable.
 12. A fluid loop monitoring andcontrol system for a semiconductor manufacturing apparatus, said systemcomprising: a vortex flow meter coupled to a fluid circulation linecoupled to and configured to deliver a fluid to a processing chamber ofsaid semiconductor manufacturing apparatus, said vortex flow meterconfigured to measure a fluid flow rate in said fluid circulation line;a flow meter display coupled to said vortex flow meter and including areadout of said measured fluid flow rate and a readout of a fluid flowtrip point associated with said vortex flow meter; an input memberdisposed on or coupled to said flow meter display and configured toadjust said fluid flow trip point, at least one of said vortex flowmeter and said flow meter display configured to deliver an electricalsignal to a processor indicating if said measured fluid flow rate hastripped said trip point; at least one of said vortex flow meter and saidflow meter display configured to deliver a further electrical signalwith said measured fluid flow rate and said trip point, to saidprocessor, said processor configured to display said flow and said fluidflow trip point setting at a remote location; and wherein said fluidcirculation line is configured to deliver fluid to a body of saidchamber and also to internal components of said chamber.
 13. A methodfor monitoring and controlling a fluid flow in a semiconductormanufacturing apparatus, said method comprising: delivering a thermalcontrol fluid via a fluid circulation system to a chamber of asemiconductor manufacturing apparatus; measuring fluid flow rate in saidfluid circulation system using a vortex flow meter; displaying anindication of said measured fluid flow rate on a flow meter display;displaying a flow trip point on said flow meter display in format;sending an electrical signal to said semiconductor manufacturingapparatus indicating if said trip point is tripped; at least one of saidvortex flow meter and said flow meter display delivering a furtherelectrical signal to a processor, said further electrical signalincluding said measured fluid flow rate and said trip point; andadjusting said fluid flow trip point using an input device associatedwith said flow meter display or said flow meter.
 14. The method as inclaim 13, further comprising said processor displaying said measuredfluid flow rate and said trip point as a function of time and saidprocessor sending signals to said semiconductor manufacturing apparatusthat adjusts flow in said fluid circulation system or terminates aprocessing operation in said chamber.
 15. The method as in claim 14,further comprising said semiconductor manufacturing apparatusautomatically adjusting said fluid flow rate or terminating a processingoperation in said chamber when said electrical signal indicates thatsaid trip point has been tripped, and wherein said processor sendingsignals overrides said manufacturing apparatus automatically adjustingsaid fluid flow rate or terminating a processing operation.
 16. Themethod as in claim 13, wherein said displaying an indication of saidmeasured fluid flow rate comprises displaying said indication in digitalformat on said flow meter display and wherein said further electricalsignal is an analog signal, and further comprising converting saidanalog signal to an RS-232 signal and delivering said RS-232 signal tosaid processor.
 17. The method as in claim 13, wherein said electricalsignal is an NPN or PNP signal delivered to a relay and furthercomprising said relay converting said NPN or PNP signal to a DC signal.18. The method as in claim 17, wherein said DC signal is a 24V DCsignal.
 19. The method as in claim 13, further comprising saidsemiconductor manufacturing apparatus automatically adjusting said fluidflow rate or terminating a processing operation when said electricalsignal indicates that said trip point has been tripped.
 20. The methodas in claim 13, wherein said semiconductor manufacturing apparatusincludes a plurality of said chambers, and corresponding ones of saidvortex flow meters, flow meter displays, fluid circulation systems, andinput devices, and further electrical signal and further comprisingcoupling said flow meter displays in series.